Micro Component Grinding

I have developed some of the most unique grinding technology for producing micro components. I have successfully ground a cylinder with 0.015″ x 0.050″ (O.L.).

I have technology and capabilities to grind parts to extremely small diameters; below .010″ in diameter.

Intellectual property and technology transfer available.

Discuss your potential project with me by calling me at (765) 561-1441.